A Thermal Shock Chamber is a specialized testing device designed to evaluate the ability of products and materials to withstand sudden and extreme temperature changes. It subjects products to rapid transitions between extremely hot and cold temperatures to identify potential failures due to material expansion, contraction, and thermal stress.
Thermal Shock Chambers are essential for electronics, automotive, aerospace, Defence, and medical device industries, where product reliability is critical. The chambers comply with industry standards like ISO 9001:2015, CE, NABL and other industry standards . By exposing products to abrupt temperature changes, manufacturers can ensure product durability, identify weak points, and certify compliance with international standards.
Products are rapidly moved between hot and cold zones for instant thermal stress.
From -70°C to +200°C, with fast cycling capability.
Mechanical lift or basket transfer system to shift products between hot and cold zones.
Thyristorized PID controller, PLC-based controller with touchscreen HMI for customizable test cycles.
Racks and baskets allow for testing multiple products simultaneously.
Real-time data logging, remote monitoring, and cloud-based data analysis.
Advanced refrigeration and heating elements for rapid thermal changes.
Complies with ISO 9001:2015, CE, NABL and other industry standards
Emergency stop, over-temperature protection, and door interlocks.
Customizable racks for testing small and large products.
Thermal shock testing of PCBs, semiconductors, and consumer electronics.
Testing ECUs, sensors, and automotive lighting for thermal shock resistance.
Verifying the durability of avionics, sensors, and critical mission components.
Ensuring that medical devices remain operational after sudden temperature changes.
Testing the durability of product packaging exposed to extreme shipping conditions.
Identifying cracks, deformation, and thermal stress in plastics, metals, and coatings.
Subjects products to sudden, extreme temperature changes (e.g., from -70°C to +200°C) to measure thermal stress.
Maintains products at a constant temperature for a specified time.
Gradually cycles between high and low temperatures to identify cracks, thermal expansion, and contraction issues.
Applies thermal shock to PCBs, semiconductors, and automotive sensors to assess durability.
Optional humidity control system for testing the effects of condensation.
Specification | Details |
---|---|
Model | Customizable (Standard & Custom Models Available) |
Temperature Range | -70°C to +200°C (Customizable Ranges) |
Temperature Accuracy | ±1°C at steady-state conditions |
Temperature Uniformity | ±2.0°C |
Transfer Time | 10-15 seconds between hot and cold zones |
Cooling Rate | 10°C to 30°C per minute (Customizable) |
Heating Rate | 10°C to 30°C per minute (Customizable) |
Chamber Type | Two-Zone and Three-Zone Chambers |
Controller Type | Thyristorized PID controller, PLC-based, Touchscreen HMI Interface |
Data Logging | USB, Ethernet, Cloud-based Remote Monitoring |
Air Circulation | Uniform airflow system for consistent test conditions |
Chamber Capacity | 50 L to 1000+ L (Benchtop, Reach-In, and Walk-In Models) |
Power Supply | 415 V/ 3-Phase (Custom Voltage Options Available) |
Noise Level | < 75 dB at full load |
Construction Material | Stainless Steel (Interior), Powder-Coated Steel (Exterior) |
Compliance | ISO 9001:2015, CE, NABL and other industry standards |
Warranty | 1 Year(Extended Warranty Available) |
Safety Features | Over-temperature protection, humidity control failure alarms, emergency stop button |
Optional Features | IoT Connectivity, Remote Monitoring, Custom Racks & Fixtures |